29 {{ "2026-06-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-29T00:00:00+00:00" | date "longDate" }}

Kvaser AB

Introducing the Kvaser PCIe 4xLIN for next-level LIN connectivity

Designed for desktop, industrial, and HIL environments, the low-profile PCIe card integrates galvanic isolation with synchronized timestamping, giving engineers reliable, system-level visibility when testing and debugging LIN networks.

Read more…

25 {{ "2026-06-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-25T00:00:00+00:00" | date "longDate" }}

Broadcom News

OpenAI and Broadcom Unveil LLM-Optimized Intelligence Processor

OpenAI and Broadcom collaborate to engineer and deploy Jalapeño, a custom artificial intelligence processor optimized for large language model inference workloads.

Read more…

24 {{ "2026-06-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-24T00:00:00+00:00" | date "longDate" }}

Anritsu News

5G RedCap Device Application Evaluation Solutions for Cellular Network Testing

Anritsu Corporation launched enhanced application evaluation solutions to streamline wireless performance testing for the growing 5G market.

Read more…

24 {{ "2026-06-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-24T00:00:00+00:00" | date "longDate" }}

Samsung News

Samsung Introduces Fastest UFS 5.0 Storage for Next-Generation Mobile AI

New memory solution delivers higher speeds, improved efficiency, and compact designs for smartphones, wearables, and XR devices.

Read more…

24 {{ "2026-06-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-24T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

Nanocrystalline cable cores for effective EMC interference suppression

The new WE-NCC series complements conventional ferrite cores, offering compact, temperature-stable, and broadband solutions designed specifically for modern power electronics and system reliability.

Read more…

23 {{ "2026-06-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-23T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Direct Time-of-Flight 3D LiDAR Module for Edge Systems

STMicroelectronics introduces a high-resolution 3D sensing module providing depth mapping and spatial awareness for robotics, industrial automation, and smart infrastructure.

Read more…

19 {{ "2026-06-19T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-19T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

Nanocrystalline EMC absorber foils for flexible enclosure shielding

The WE-FNCS nanocrystalline foil developed by Würth Elektronik offers a highly flexible solution for suppressing low-frequency electromagnetic interference (EMI) in electronic devices.

Read more…

19 {{ "2026-06-19T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-19T00:00:00+00:00" | date "longDate" }}

Rutronik News

Precise Distance Measurement for Short-Range Wireless Sensor Networks

Rutronik introduces a compact hardware platform leveraging the latest Bluetooth positioning standards to enable efficient asset tracking without complex ultra-wideband architectures.

Read more…

18 {{ "2026-06-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-18T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Integration of System-Level Simulation in Photonic Design Automation

Keysight Technologies integrates newly acquired VPIphotonics software suites to enable unified electrical-optical-electrical link validation for high-performance data center infrastructure.

Read more…

17 {{ "2026-06-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-17T00:00:00+00:00" | date "longDate" }}

Kontron News

Integrated Processor Architecture Deployment for Edge AI Platforms

Kontron incorporates Core Ultra Series 3 processors into embedded computing boards to consolidate neural processing tasks in space-constrained industrial environments.

Read more…

Case studies

Interactive Installations

Introducing the Kvaser PCIe 4xLIN for next-level LIN connectivity

Designed for desktop, industrial, and HIL environments, the low-profile PCIe card integrates galvanic isolation with synchronized timestamping, giving engineers reliable, system-level visibility when testing and debugging LIN networks.

OpenAI and Broadcom Unveil LLM-Optimized Intelligence Processor

OpenAI and Broadcom collaborate to engineer and deploy Jalapeño, a custom artificial intelligence processor optimized for large language model inference workloads.

5G RedCap Device Application Evaluation Solutions for Cellular Network Testing

Anritsu Corporation launched enhanced application evaluation solutions to streamline wireless performance testing for the growing 5G market.

Samsung Introduces Fastest UFS 5.0 Storage for Next-Generation Mobile AI

New memory solution delivers higher speeds, improved efficiency, and compact designs for smartphones, wearables, and XR devices.

Nanocrystalline cable cores for effective EMC interference suppression

The new WE-NCC series complements conventional ferrite cores, offering compact, temperature-stable, and broadband solutions designed specifically for modern power electronics and system reliability.

Direct Time-of-Flight 3D LiDAR Module for Edge Systems

STMicroelectronics introduces a high-resolution 3D sensing module providing depth mapping and spatial awareness for robotics, industrial automation, and smart infrastructure.

Nanocrystalline EMC absorber foils for flexible enclosure shielding

The WE-FNCS nanocrystalline foil developed by Würth Elektronik offers a highly flexible solution for suppressing low-frequency electromagnetic interference (EMI) in electronic devices.

Precise Distance Measurement for Short-Range Wireless Sensor Networks

Rutronik introduces a compact hardware platform leveraging the latest Bluetooth positioning standards to enable efficient asset tracking without complex ultra-wideband architectures.

Integration of System-Level Simulation in Photonic Design Automation

Keysight Technologies integrates newly acquired VPIphotonics software suites to enable unified electrical-optical-electrical link validation for high-performance data center infrastructure.

Integrated Processor Architecture Deployment for Edge AI Platforms

Kontron incorporates Core Ultra Series 3 processors into embedded computing boards to consolidate neural processing tasks in space-constrained industrial environments.

International