MediaTek introduces Genio Pro, Genio 420 and Genio 360 platforms delivering generative AI acceleration and multimedia support for edge AI and IoT devices.
Kyocera introduces an OSFP-XD optoelectronic module supporting PCIe 6.0 optical interconnects to increase bandwidth and reduce power consumption in data center architectures.
NXP Semiconductors introduces i.MX 93W to combine edge AI acceleration and tri-radio wireless connectivity for industrial, healthcare and IoT edge systems.
Next-generation SABdynamic cables achieve high flexibility, robustness and signal integrity for cable track systems and robotics without sacrificing reliability under extreme motion stress.
Razorcat and SEGGER expand cooperation to integrate test automation with embedded development tools, supporting verification workflows in safety-critical embedded systems.
New Ryzen AI Embedded P100 processors deliver higher CPU core counts, increased AI throughput, and integrated CPU, GPU, and NPU acceleration for industrial and robotics edge systems.
PIC100 platform manufactured on 300 mm lines supports 800G and 1.6T optical interconnects for hyperscale AI infrastructure and high-bandwidth data-center networking.