As hyperscale data centers push beyond 51.2 Tb/s switch bandwidth, CPO offers a sustainable path forward by addressing the power constraints and physical limitations of traditional pluggable optics.
Würth Elektronik presents compact Tarvos e and Olis e radio modules, 12×8×2 mm, CC1310-based, energy-efficient, ideal for proprietary wireless solutions and battery-powered devices.
Schaeffler implements ASMPT SIPLACE SX and Viscom AOI systems, creating connected SMT lines that automatically adapt to alternative components for efficient, flexible electronics production.
The new confocalDT IFC2411 and IFC2416 controllers offer precise, fast distance and thickness measurements up to 25 kHz, high light intensity, and easy industrial integration via modern interfaces.
CEA-Leti and French research partners created a CMOS-compatible hybrid memory combining ferroelectric capacitors and memristors, enabling adaptive on-chip AI learning and inference for edge devices.
The DLP991UUV features 8.9M pixels, sub-micron resolution, and 110 gigapixels/sec throughput, enabling scalable, cost-effective maskless lithography for advanced packaging.
The next-gen 5A PXI/PXIe battery simulator enables precise BMS testing with four fully isolated channels per slot, high-current drive, and integrated hardware safety features.