24 {{ "2026-09-24T00:00:00+00:00" | date "MMM" }} '26

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Samsung News

Adaptive High-Bandwidth Memory for Mobile AI

Samsung validates its next-generation LPDDR memory on Qualcomm’s mobile platform to address rising bandwidth and power demands of edge AI.

Read more…

24 {{ "2026-09-24T00:00:00+00:00" | date "MMM" }} '26

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Qualcomm News

Micro-Power Processing Architectures for Multimodal Audio Wearable Devices

Qualcomm introduces a new processing platform that integrates artificial intelligence and micro-power Wi-Fi connectivity to support multimodal smart wearable ecosystems.

Read more…

24 {{ "2026-09-24T00:00:00+00:00" | date "MMM" }} '26

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Synopsys News

Accelerating System Design on Advanced Semiconductor Nodes

Synopsys and TSMC collaborate to deploy automated EDA workflows and unified multiphysics verification for high-performance computing components.

Read more…

24 {{ "2026-09-24T00:00:00+00:00" | date "MMM" }} '26

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FLIR

FLIR Launches Si2a-LD and Si2a-Pro Fixed Acoustic Imaging Cameras for Continuous Asset Condition Monitoring

Teledyne FLIR completes its Si2a-Series portfolio for continuous condition monitoring.

Read more…

24 {{ "2026-09-24T00:00:00+00:00" | date "MMM" }} '26

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Siemens News

Siemens & TSMC Automate Advanced Semiconductor Node Design

New agentic workflows accelerate physical verification, thermal analysis, and packaging integration across sub-2nm processes and silicon photonics architectures.

Read more…

23 {{ "2026-09-23T00:00:00+00:00" | date "MMM" }} '26

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STMicroelectronics News

Advanced 6-Axis Motion Sensors for Sustainable Smart Devices

STMicroelectronics launches sustainable 6-axis motion sensors featuring super-symmetric gyroscope architectures and dual-accelerometer tracking for industrial and consumer smart applications.

Read more…

22 {{ "2026-09-22T00:00:00+00:00" | date "MMM" }} '26

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Fraunhofer News

Fraunhofer IPMS Develops 5,040 PPI Full-Color OLED Microdisplay

28 nm CMOS technology combines 2.52 µm subpixels and flexible driving modes for efficient AR, VR devices, showcased at Eurodisplay 2026.

Read more…

21 {{ "2026-09-21T00:00:00+00:00" | date "MMM" }} '26

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BAE SYSTEMS News

Development of 45-Nanometer Radiation-Hardened Space Microelectronics

BAE Systems and GlobalFoundries are collaborating to manufacture custom application-specific integrated circuits for space-grade digital infrastructure.

Read more…

21 {{ "2026-09-21T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-21T00:00:00+00:00" | date "longDate" }}

Nordson Test & Inspection News

Semiconductor Acoustic Inspection and X-Ray Metrology

Nordson introduces advanced acoustic and X-ray systems to enhance defect detection, process control, and throughput across the semiconductor data ecosystem.

Read more…

19 {{ "2026-09-19T00:00:00+00:00" | date "MMM" }} '26

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Infineon News

Acquisition of Semiconductor Memory Business Supports Portfolio Optimization

Infineon sells NOR Flash and F-RAM assets to Winbond for $1.12 billion to concentrate resources on primary growth markets.

Read more…

Technical Articles

75 GB/s Data Acquisition to Disk

Adaptive High-Bandwidth Memory for Mobile AI

Samsung validates its next-generation LPDDR memory on Qualcomm’s mobile platform to address rising bandwidth and power demands of edge AI.

Micro-Power Processing Architectures for Multimodal Audio Wearable Devices

Qualcomm introduces a new processing platform that integrates artificial intelligence and micro-power Wi-Fi connectivity to support multimodal smart wearable ecosystems.

Accelerating System Design on Advanced Semiconductor Nodes

Synopsys and TSMC collaborate to deploy automated EDA workflows and unified multiphysics verification for high-performance computing components.

FLIR Launches Si2a-LD and Si2a-Pro Fixed Acoustic Imaging Cameras for Continuous Asset Condition Monitoring

Teledyne FLIR completes its Si2a-Series portfolio for continuous condition monitoring.

Siemens & TSMC Automate Advanced Semiconductor Node Design

New agentic workflows accelerate physical verification, thermal analysis, and packaging integration across sub-2nm processes and silicon photonics architectures.

Advanced 6-Axis Motion Sensors for Sustainable Smart Devices

STMicroelectronics launches sustainable 6-axis motion sensors featuring super-symmetric gyroscope architectures and dual-accelerometer tracking for industrial and consumer smart applications.

Fraunhofer IPMS Develops 5,040 PPI Full-Color OLED Microdisplay

28 nm CMOS technology combines 2.52 µm subpixels and flexible driving modes for efficient AR, VR devices, showcased at Eurodisplay 2026.

Development of 45-Nanometer Radiation-Hardened Space Microelectronics

BAE Systems and GlobalFoundries are collaborating to manufacture custom application-specific integrated circuits for space-grade digital infrastructure.

Semiconductor Acoustic Inspection and X-Ray Metrology

Nordson introduces advanced acoustic and X-ray systems to enhance defect detection, process control, and throughput across the semiconductor data ecosystem.

Acquisition of Semiconductor Memory Business Supports Portfolio Optimization

Infineon sells NOR Flash and F-RAM assets to Winbond for $1.12 billion to concentrate resources on primary growth markets.

International